Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

Written By Hengyun Zhang
Modeling  Analysis  Design  and Tests for Electronics Packaging beyond Moore
  • Publsiher : Woodhead Publishing
  • Release : 22 November 2019
  • ISBN : 0081025335
  • Pages : 434 pages
  • Rating : 4/5 from 21 reviews
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Read or download book entitled Modeling Analysis Design and Tests for Electronics Packaging beyond Moore written by Hengyun Zhang which was release on 22 November 2019, this book published by Woodhead Publishing. Available in PDF, EPUB and Kindle Format. Book excerpt: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging

Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

Modeling  Analysis  Design  and Tests for Electronics Packaging beyond Moore
  • Author : Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
  • Publisher : Woodhead Publishing
  • Release Date : 2019-11-22
  • Total pages : 434
  • ISBN : 0081025335
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Summary : Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and ...

Modeling Analysis Design and Tests for Electronics Packaging Beyond Moore

Modeling  Analysis  Design and Tests for Electronics Packaging Beyond Moore
  • Author : 张恒运,车法星,林挺宇,赵文生
  • Publisher : Unknown
  • Release Date : 2021
  • Total pages : 420
  • ISBN : 0081025335
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Summary : Download or read online Modeling Analysis Design and Tests for Electronics Packaging Beyond Moore written by 张恒运,车法星,林挺宇,赵文生, published by which was released on 2021. Get Modeling Analysis Design and Tests for Electronics Packaging Beyond Moore Books now! Available in PDF, ePub and Kindle....

Advances in Robotics Automation and Data Analytics

Advances in Robotics  Automation and Data Analytics
  • Author : Jessnor Arif Mat Jizat,Ismail Mohd Khairuddin,Mohd Azraai Mohd Razman,Ahmad Fakhri Ab. Nasir,Mohamad Shaiful Abdul Karim,Abdul Aziz Jaafar,Lim Wei Hong,Anwar P. P. Abdul Majeed,Pengcheng Liu,Hyun Myung,Han-Lim Choi,Gian-Antonio Susto
  • Publisher : Springer Nature
  • Release Date : 2021-03-10
  • Total pages : 415
  • ISBN : 0081025335
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Summary : This book presents essentially a collection of proceedings that deliberate on the key challenges and recent trends on robotics, automation and data analytics which are the pillars of Industry 4.0. Solutions that are employed in the multitude spectra of innovative robotics & automation and data analytics are discussed. The readers are expected ...

Heat Exchangers

Heat Exchangers
  • Author : Laura Castro Gómez,Víctor Manuel Velázquez Flores,Miriam Navarrete Procopio
  • Publisher : BoD – Books on Demand
  • Release Date : 2022-03-23
  • Total pages : 246
  • ISBN : 0081025335
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Summary : The demand for energy to satisfy the basic needs and services of the population worldwide is increasing as are the economic costs associated with energy production. As such, it is essential to emphasize energy recovery systems to improve heat transfer in thermal processes. Currently, significant research efforts are being conducted ...

Physical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits
  • Author : Aida Todri-Sanial,Chuan Seng Tan
  • Publisher : CRC Press
  • Release Date : 2017-12-19
  • Total pages : 397
  • ISBN : 0081025335
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Summary : Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, ...

More than Moore

More than Moore
  • Author : Guo Qi Zhang,Alfred van Roosmalen
  • Publisher : Springer Science & Business Media
  • Release Date : 2010-01-23
  • Total pages : 332
  • ISBN : 0081025335
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Summary : In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not ...

Arbitrary Modeling of TSVs for 3D Integrated Circuits

Arbitrary Modeling of TSVs for 3D Integrated Circuits
  • Author : Khaled Salah,Yehea Ismail,Alaa El-Rouby
  • Publisher : Springer
  • Release Date : 2014-08-21
  • Total pages : 179
  • ISBN : 0081025335
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Summary : This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, ...

Extending Moore s Law through Advanced Semiconductor Design and Processing Techniques

Extending Moore s Law through Advanced Semiconductor Design and Processing Techniques
  • Author : Wynand Lambrechts,Saurabh Sinha,Jassem Ahmed Abdallah,Jaco Prinsloo
  • Publisher : CRC Press
  • Release Date : 2018-09-13
  • Total pages : 354
  • ISBN : 0081025335
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Summary : This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research ...

Routing Congestion in VLSI Circuits

Routing Congestion in VLSI Circuits
  • Author : Prashant Saxena,Rupesh S. Shelar,Sachin Sapatnekar
  • Publisher : Springer Science & Business Media
  • Release Date : 2007-04-27
  • Total pages : 250
  • ISBN : 0081025335
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Summary : This volume provides a complete understanding of the fundamental causes of routing congestion in present-day and next-generation VLSI circuits, offers techniques for estimating and relieving congestion, and provides a critical analysis of the accuracy and effectiveness of these techniques. The book includes metrics and optimization techniques for routing congestion at ...

VLSI Systems Design

VLSI Systems Design
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1986
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online VLSI Systems Design written by , published by which was released on 1986. Get VLSI Systems Design Books now! Available in PDF, ePub and Kindle....

Advanced Nanoelectronics

Advanced Nanoelectronics
  • Author : Muhammad Mustafa Hussain
  • Publisher : John Wiley & Sons
  • Release Date : 2019-01-04
  • Total pages : 288
  • ISBN : 0081025335
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Summary : Brings novel insights to a vibrant research area with high application potential?covering materials, physics, architecture, and integration aspects of future generation CMOS electronics technology Over the last four decades we have seen tremendous growth in semiconductor electronics. This growth has been fueled by the matured complementary metal oxide semiconductor (...

Advances in Thermal Modeling of Electronic Components and Systems

Advances in Thermal Modeling of Electronic Components and Systems
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1998
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online Advances in Thermal Modeling of Electronic Components and Systems written by , published by which was released on 1998. Get Advances in Thermal Modeling of Electronic Components and Systems Books now! Available in PDF, ePub and Kindle....

Technology for Large Space Systems

Technology for Large Space Systems
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1987
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online Technology for Large Space Systems written by , published by which was released on 1987. Get Technology for Large Space Systems Books now! Available in PDF, ePub and Kindle....

Advanced Materials Processes

Advanced Materials   Processes
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1995
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online Advanced Materials Processes written by , published by which was released on 1995. Get Advanced Materials Processes Books now! Available in PDF, ePub and Kindle....

Multichip Module Design Fabrication and Testing

Multichip Module Design  Fabrication  and Testing
  • Author : James J. Licari
  • Publisher : McGraw-Hill Companies
  • Release Date : 1995
  • Total pages : 381
  • ISBN : 0081025335
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Summary : The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested and manufactured. This evolving technology for packaging printed circuit boards (PCBs) is commanding both interest and excitement....